Samsung Galaxy S7 to feature internal heat pipe for better heat dissipation?

The Samsung Galaxy S7 is expected to rock the most powerful processors the industry has to offer. The problem with this, however, is that more power generates more heat that could lead to overheating. So how is Samsung planning to address this problem? A new report claims to know what the Korean tech giant is working on to tackle the problem.

Internal heat pipes

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The new rumour comes to us courtesy of Chinese-speaking udn.com. According to the report, Samsung is experimenting on a number of heat pipes of various shapes and sizes, trying to decide which one would be used on the Samsung Galaxy S7. Samsung is said to be testing which one better dissipates heat.

So why is Samsung experimenting on various internal heat pipes? Half of Samsung Galaxy S7 units are expected to rock Qualcomm’s Snapdragon 820 SoC, while the other half is expected to feature Samsung’s Exynos 8890 SoC under the hood. The two have done well in benchmark tests, with the Exynos 8890 SoC breaking records both on the AnTuTu and Geekbench benchmark sites. If you remember earlier this year, the Snapdragon 810 SoC was expected to be the processor to beat, but this power came at a price. It had a tendency to overheat, which resulted in devices crashing. This said, it’s understandable why Samsung is so concerned.

Here’s what we know so far:

The Samsung Galaxy S7 is said to be available in two screen sizes. One is said to feature a regular 5.2-inch screen (regular S7), while the other is said to feature a bigger 5.7-inch curved screen (S7 Edge). The S7 is expected to feature a microSD card slot, unlike the Galaxy S6 and Galaxy S6 Edge. As far as RAM goes, the S7 is said feature 4 GB of RAM. In the photography department, the S7 is said to feature Samsung’s new 20-megapixel BRITECELL rear-facing camera. Lastly, it is said to feature a USB Type-C connector, which seems to be the trend of flagships these days. A USB Type-C connector allows users to enjoy more from faster data transfer and faster charging. It also allows users to never worry about plugging in the USB connector the wrong way, since it is reversible.

It was believed to make its official debut earlier than expected, but recent reports are now saying that the S7 will be unveiled on the 21st of February, a day before MWC 2016, which kicks off in Barcelona, Spain. This is the same time Samsung announced this year’s Galaxy S6. The difference is, however, is that Samsung is said to be planning to launch its next flagship earlier than expected, possibly soon after its unveiling.

Of course, since this is anything but official, take it with a pinch of salt.

Do you think the Samsung Galaxy S7 will feature internal heat pipes? Let us know what you think through a comment on our Phones LTD Facebook page.

 

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