Recently, Samsung filed a trademark for the term “BRITECELL” in the US, which is likely to be new camera tech. The Korean tech giant has developed a new 20-megapixel sensor with RWB pixel arrangement. This new sensor is said to feature a colour pattern that enhances sensitivity and improve the signal-to-noise ratio in low-light conditions. This sensor that offers superior performance even in low-light conditions may be Samsung’s BRITECELL tech, which could find its way to the Galaxy S7. Now, a new trademark filing keeps us guessing even more on what the S7 has to offer, when it comes to innovations in the camera department.
SamMobile was first to spot a recent trademark patent filing made by Samsung with the USPTO called “Duo Pixel.” Unfortunately, the filing doesn’t reveal what this trademark is all about, but it’s a dead cert that this has something to do with new camera tech.
So what is Duo Pixel all about? Unfortunately, this is yet to be determined at the moment. However, this could be the new 12-megapixel sensor with dual-PD (dual-photodiode) tech, which Samsung is said to be getting ready to mass produce. This new sensor features a new focusing system that will replace phase-detection AF.
Here’s another possibility. A past rumour has claimed that the Samsung Galaxy S7 would feature a dual-camera setup. If this rumour is to be believed, the Duo Pixel trademark definitely makes sense.
Of course, since this is all speculation for now, take it with a pinch of salt.
So far, we’ve learned from past rumours that there will be different versions of the Galaxy S7. One is said to be the regular 5.1-inch flat version; another is said to be a 5.7-inch curved version (Galaxy S7 Edge Plus), and another version, according to recent reports, is a 6-inch version called the Galaxy S7 Plus. As for the processor under the hood, markets such as the US and China are said to feature the Qualcomm Snapdragon 820 SoC, while markets such as the UK are said to rock the Samsung-made Exynos 8890 SoC. The S7 is expected to feature 4 GB of RAM. Unlike the S6, the S7 is said to feature a microSD card slot. For better heat management, Samsung is said to be testing a variety of heat pipes. A USB Type-C connector is said to be on board.
Samsung is expected to lift the lid on the Galaxy S7 on the 21st of February in Barcelona, Spain, a day before MWC 2016 kicks off. We’ll know by then if the rumours are true.
Keep it here at Phones LTD for further updates.