New Huawei Mate 8 photo leaked

Huawei is rumoured to be planning to lift the lid on a new high-end smartphone – the Huawei Mate 8. One image that allegedly shows the device has already been leaked online, but the device in the image was wearing a protective case, which obscured the device’s overall design. The good news is, a new photo that allegedly shows the device has been leaked. This time, however, there is no protective case, which means we can see the device in all of its glory.

New leaked image

CT9piilWwAAn1od

The image seen above was leaked by @OnLeaks, a Twitter account known for leaking accurate information on yet to be announced devices. The image confirms that the Huawei Mate 8 features a round fingerprint scanner that can be found below its rear-facing camera. This is also what can be found on the new Nexus 6P, which happens to be made also by Huawei.

Also revealed by the leaked image is a microUSB port at the bottom of the smartphone and what looks like speakers on the right and left of the microUSB port. Judging from what we can see, the Huawei Mate 8 appears to be a thin device.

The Huawei Mate 8 is expected to sport a 6-inch screen with a resolution of 1080 x 1920 pixels. Under the hood is expected to be Huawei’s Kirin 950 octa-core processor. Its camera combo is said to consist of either a 16-megapixel or a 13-megapixel rear-facing camera and an 8-megapixel front-facing camera to care of snapping selfies and video chat. It is also expected to feature a massive battery with fast charging capabilities. There are said to be two versions of the Mate 8. One is said to feature 3 GB of RAM and 32 GB of internal storage, while the other is said to feature 4 GB of RAM and 64 GB of internal storage.

Huawei is expected to lift the lid on the Mate 8 on the 26th of November.

Of course, since we can’t confirm if the device in the image is the Huawei Mate 8, take this with a pinch of salt.

Like what you see? Drop a comment on our Phones LTD Facebook page.

Leave a Reply

Your email address will not be published. Required fields are marked *