We’ve come across numerous reports, revealing that Qualcomm’s Snapdragon 810 64-bit octa-core processor is suffering from overheating issues. According to a post on Chinese micro-blogging site Weibo, Qualcomm has resolved the overheating issues and that the CPU will be mass produced in mid-March.
With Qualcomm reportedly solving the Snapdragon 810’s overheating issues and the CPU to be mass produced in mid-March, it looks like this year’s flagships will not be delayed.
Today’s industry leaders have all said that the Snapdragon 810 will be on board their premium smartphones. We already know that the LG G Flex 2 will have the CPU under the hood, which means it’s a dead cert that the LG G4 will have the same CPU under the hood as well. HTC and Sony have also said that the CPU will be on board their smartphones, suggesting that the HTC One (M9) and the Sony XPERIA Z4 will sport the powerful processor. Two more major manufacturers, Motorola and Microsoft, have also promised to use Qualcomm’s new CPU. However, it is yet to be determined which of their upcoming smartphones will sport the CPU under the hood.
Qualcomm did say that one major manufacturer will not be using the Snapdragon 810. Although the chip maker did not mention names, it is believed that this is Samsung. According to reports, Samsung has refined its 14 nm manufacturing process of its Exynos processors to be used on its next flagship the Galaxy S6. Samsung is reportedly planning to compete with Qualcomm in the CPU arena.
Relieved Qualcomm has resolved the overheating issues of the Snapdragon 810? Let us know through a comment on our Phones LTD Facebook page.